Huawei had big plans at the beginning of the year about targeting the Western market. The plans did not bear fruit, but the Chinese OEM is back in action by planning some high-end phones intended for the US and European markets. The Ascent D2 was shown off at a presentation event in China about a month ago, and the company had conveniently left out the mention of many of its features which are slowly being revealed now.
According to the information given at GLBenchmark, the smartphone is 5 inches long with edge-to-edge high definition( 1920 x 1080 pixels) display and is likely to feature on-screen buttons. The 1.5 GHz quad chip will be combined with GPU from Hisilicon Technologies. It is anybody’s guess about the model of the processor.
It has also been confirmed in the Benchmark that the device will run Android 4.1 Jelly Bean though it could easily be upgraded to supporting 4.2 by the time it is ready for release.
Rumors are abound about the device’s tentative release time. It has been leaked that the next public presentation of the smartphone is scheduled for CES 2013 in January. The commercial launch will most probably take place soon after this. China will be the first to get D2 while a global release is still unpredictable.
The specifications that were revealed earlier includes 1.3 MP camera facing front, 13 MP shooting which is rear-facing as well as a 3000 mAh battery. There would be a 2 GB RAM and on-board storage could be at the very least 16 GB.