After Qualcomm which announced its latest Snapdragon 802 and 602A chipsets at the Consumer Electronics Show in Las Vegas, Chinese chip maker MediaTek also announced its first LTE modem platform, called the MT6290. The new product will hit the market supporting all MediaTek SoCs, including the octa-core MT6592 processor that was launched in the Q4 last year.
The latest chip is an LTE Release 9 Category 4 modem built on the 28nm process with a wireless baseband processor based on the Coresonic SIMT architecture. It also supports DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS. The latest LTE modem is also capable of delivering LTE data rates as high as 150Mbit/s downlink and 50Mbit/s uplink.
According to the company, the new product is already being tested at wireless carriers around the world, and the first devices to include it are expected to become available for purchase in the second quarter of the year.
MediaTek says, "The supporting RF chip in the platform is called MT6169 which supports up to 8 primary RF inputs (3 high bands, 2 mid bands, 3 low bands), plus another 8 RF inputs for diversity gains."
Reportedly, MediaTek has also partnered with VIA Telecom to integrate CDMA2000 technology into the upcoming Worldmode mobile platforms with new SOCs. It supports voice and data services across mobile networks globally.
Further the company also says that the new chip comes with support for both FDD and TDD (Frequency Division Duplex and Time Division Duplex) modes of LTE, which ensures that devices will enjoy broad compatibility with mobile operator networks.
It should be noted that the MT6290 is fully-compatible with the current 3G mobile SOCs from MediaTek and next-generation MediaTek SOCs with LTE integration will be sampling throughout 2014. While the first commercial devices are expected in the first half of 2015.