The yet to be announced, Samsung Galaxy S7 which was being speculated for some time, is now being said to sport a magnesium alloy frame. The glass back panel would stay the same as seen with Galaxy S6 earlier this year, said a post on Weibo. This would make the smartphone sturdier than before and also give it some more premium feel.
As per the report that appeared on a Chinese website, the upcoming S7 handset would include a Sabre 9018AQ2M audio chip by ESS Technology, that let users to listen to hi-fi grade audio. The chip is said to feature 129 dB signal-to-noise ratio and support PCM up to 32-bit and 384 KHz along with DSD 11.2 MHz sampling.
The chip will take up to 1mW in standby mode and not more than 40mW even in heavy usage. However, Samsung is yet to confirm any developments on this front or even refuse to accept the the existence of the S7.
Samsung has been granted a patent by the South Korean IP office for a pressure sensitive touch display technology, similar to Apple's 3D Touch feature. As revealed by the Korean Intellectual Property Office, the device would display different results based on how hard the display is pressed.
The pressure is measured via voltage levels .If a user presses the key 'q', they would get a lowercase letter. However, pressing the key for a longer time could display the letter in uppercase. The patent comes at the time, when Samsung is said to use the Synaptics' ClearForce pressure-sensitive touch solution for its next Galaxy smartphone, quite contradictory to existing reports.
Earlier this week, another report said that Samsung would be unveiling the rumored Galaxy S7 smartphone in January 2016. However, there is an air of contradiction here as the Mobile World Congress trade show usually takes place between February and March. There has been no official word of confirmation from Samsung as of yet.