Qualcomm Snapdragon 820 has been making round for quite a while now. In fact Qualcomm desperately needs a new flagship SoC in the market. The company's present SoC has been able to win many a hearts out there thanks to its heating and throttling issues. Despite Qualcomm's attempt to limit the heating issue by clocking down the cores in the v2.1 of the SoC, much has improved.
On the other hand the specifications of the Qualcomm 820 got leaked a few day back. Recent reports also suggest that the SoC is said to be unveiled on the 11th of August. There's a mixed feeling among enthusiasts regarding the chip - while on section is awed at the specs, the other feels that this might be a heating bar again.
Tech analysts at Gizbot though are highly optimistic regarding the SoC. Considering the fact that Mediatek is consistently improving their SoC and increasing device portfolio and Intel taking the mobile SoC game seriously, tough times lies ahead for Qualcomm.
Nevertheless, rumours suggest that already a few companies has shown their allegiance to the Qualcomm's new SoC and are developing their flagship devices based on the same. Here's a sneak peek into the rumoured devices to boast the Qualcomm Snapdragon 820 SoC inside:
The specs of this year's Nexus device made by Huawei had been roaming round the web for quite a while now. In fact according to the latest set of leaks by serial leakster @evleaks the device is said to boast a Full Meta build, 6 inch Quad HD (2560x1440) display with 4GB of RAM. Plus the device said to feature a fingerprint sensor situated just below the rear camera - after all the device will run on Android M (native fingerprint support) out of the box. Not details about the camera is known so far though. But tech analyst at Gizbot reckon that it will feature a 20.7MP Sony unit on the rear with an 8MP on the front. The device is hinted to launch somewhere around September this year.
Recent rumours suggest that the world's third largest smartphone maker may launch two variant of their flagship Mi device namely the Mi5 and Mi5 Plus. While the Mi5 is said to feature a Qualcomm Snapdragon 810 SoC, the Mi5 Plus is tipped to receive a SD820 under the hood. Additionally it is said to feature a 20.7MP camera with OIS. This device too is said to launch in September.
The last flagship from the company aka. the Z3+ wasn't taken quite well by media and fan alike. Despite having a hefty price tag, the device came with near same specifications to the last gen Z3. Neverthless the company had announced that their ‘Real Flagship' will come in September this year.
Reports suggest that the Xperia Z5 is already in the making featuring the Qualcomm's latest gen SoC with a 6 inch Quad HD (2560x1440) display on the front. Plus it will most probably boast of the 21.7MP camera on the back with the company's latest Hybrid Focus technology. The RAM so far is tipped to be a 4GB LPDDR3.
Heard of the LG's G Flex series right? If the company's flexible design devices has attracted you so far then it's worth noting that the device is in work with the recent SD820 SoC inside. The LG G Flex 2 on the other hand features a SD810 inside. Not much is known of the device hence far. But Gizbot believes that it will come with a 4GB of RAM and 13MP OIS camera on the back. The LG G Flex 3 is tipped to launch in either Q1 or Q2 of 2016.
According to leaks, this is the new flagship device the Taiwanese company has been working on. So far HTC has tried it's best to keep the new sensation under wraps. But a leak suggest that it is said to pack the SD820 inside. After not much of a success from the One M9, HTC desperately need a device that can catch the buyer's imaginations. Can HTC Aero be the one? Only time will tell. Don't expect the device to be unveiled this year though.
We are quite excited to check out any of these devices - after all it will come with the SD820 under the hood. But are you?
Do note that these devices are still in the leaks stage. So do take the info with a pinch of salt.