LeEco Le Max Pro has finally cleared TENAA certification in China earlier today, thereby hinting at an imminent launch. LeEco previously called Letv had originally showcased this device at the CES 2016 at Las Vegas alongside Qualcomm. For those unaware this is officially the first phone to be 'showcased' with the latest Snapdragon 820 chip on the inside.
The LeEco Le Max Pro has a lot of similarities in with its predecessor the Le Max which was launched last year; especially in its external footprint. The all metal unibody design language is also supposedly carried forwards from its predecessor. The main changes however, lies in the internals.
The latest flagship smartphone from the Chinese brand sports a 6.33 inch QHD (2560x1440p) IPS display upfront. Under the hood it is powered by the 64 bit Qualcomm Snapdragon 820 SoC coupled with a Adreno 530 GPU. This is clubbed with a 4GB RAM and 64GB of on board storage.
The camera department too has received some major improvements including the presence of 21MP f/2.0 rear camera with Sony IMX230 sensor and dual tone LED flash. The front on the other hands boasts of a 4MP selfie snapper equipped with Omnivision OV4688 sensor.
Connectivity wise the smartphone comes with an USB Type C port, MHL 3.0, 3.5mm audio jack, Wireless HDMI, Wi-Fi 802.11 ad 2x2 MU-MIMO, Tri-band Wi-Fi, Bluetooth 4.1, A-GPS and 4G LTE support. For those unaware the smartphone can handle download speeds as high as 600Mbps thanks to the 802.11ad multi-gigabit Wi-Fi and X12 LTE.
Apart from that the LeEco Le Max Pro boasts of a Fingerprint Sensor on the rear which makes use of Qualcomm's much touted Qualcomm Sense ID Fingerprint technology. There's also NFC for using the device for mobile payment purposes. And all this is powered by a 3400mAh battery which is sits flush under the hood.