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Chinese smartphone maker Huawei is back in news and this time the reports have arrived a few days before the start of the upcoming Mobile World Congress (MWC) 2014 event that's set to be held in Barcelona, Spain.
If rumors are to believed, China-based tech giant Huawei is set to bring its next high-end smartphone, the Ascend D3, to this year's MWC. And while it was massively expected that Huawei would stop for a while before releasing its new smartphone, a new contender in that race has arrived from the company in the form of Ascend D3.
While everything related to the device is still in a state of rumor and has to be taken with a pinch of salt, it is currently being said that the device will be arriving with an in-house Kirin 920 octa-core CPU that's clocked at 1.8GHz.
Apparently, the in-device chip is based on ARM's big.LITTLE microchip, which has been built on two different pairs of cores - four slower and four faster-working, technically speaking. Also, it has been worked on via a 28nm architecture, and has four Cortex A7 and four Cortex A9 processors.
And even if this is indeed true, it's not really something groundbreaking since there are many more in the market that generate far more power in-device.
However, it seems like Huawei News has a bit more information about the device as the report states that "a trustworthy source at Weibo announced that Ascend D3′s processor will be HiSilicon Kirin 920 clocked at 1.8Ghz, which will be a 8 core ARM big.LITTLE based microchip."
Apart from that, although we don't have much idea about the device, it is being said that the Ascend D3 could also arrive with a 5-inch 1080p display, 16-megapixel main camera, and may feature a somewhat metal build.
However, all this might not be enough to save the device provided the rumored specs for the likes of Samsung Galaxy S5 and HTC M8 actually turn out to be true.