We have lately heard a lot about Huawei's upcoming HiSilicon Kirin 970 Soc which is finally followed by leaked specifications of the processor. The information appeared on Weibo, a Chinese micro blogging platform. The processor will supposedly feature eight 64-bit cores clubbed in two quad-core clusters. One of the clusters will have Cortex-A73 cores clocked at 2.8GHz while the other cluster will have Cortex-A 53 cores.
The clock speed for the A 53 core is yet unknown. However, given that the Cortex-A73 core will be performing at a high frequency, the A 53 core can be expected to operate at 2GHz. It has also come to light that the Kirin 970 will support LPDDR4 RAM with a maximum clock speed of 1,866 MHz. The Soc will be equipped with Mali-Gz2 MP8 graphics chip and will have Bluetooth 4.2 and Wi-Fi 802.11 a/b/g/n/ac support. The Soc will not get a Bluetooth 5.0 support while the innovation has already been commercialized. Kirin 970 is the first Soc fabricated on a 10nm process node while its LTE modem will be Cat.12 protocol compatible. The specifications of the Soc make it comparable to few of the best processors available to date, viz. Qualcomm Snapdragon 835 and the Samsung-made Exynos 8895.
It has also been reported that the Soc is already in the mass production and will be commercialized within a couple of months. The Huawei Mate 10 is rumored to be powered by this Soc. The device will supposedly be unveiled on October 16 at a launch event in Munich, Germany.