For past few days, there were lots of rumours and speculations about the LeEco Le 2 revealing the live images and specifications. Today, the company has released a teaser image on Weibo, hinting at Qualcomm's ultrasonic fingerprint sensor for LeEco Le 2.
As per the teaser image, the LeEco Le 2 might employ ultrasonic fingerprint sensor which sports Qualcomm's Sense ID technology. With this ultrasonic method, the device can detect your fingerprint, even when your fingerprint is wet or dirty. However, this technology was already employed in LeEco Le Max Pro device.
According to the rumoured specifications, the LeEco Le 2 will be powered by a Quad-core 64-bit chipset, the Snapdragon 820 is succeeding the infamous flagship Snapdragon 810 processor of 2015. Clocked at 1.8 GHz, the processor will be accompanied by the Adreno 530 GPU.
It is also rumoured that there will be two variants of the LeEco Le 2 - one with Snapdragon 820 and the other one powered by the Mediatek Helio X20 processor. If the rumour turns out to be true, this device will sport a metal body along with USB Type-C.
Moreover, the LeEco Le 2 is expected to pack a 4GB RAM, along with 21MP of the rear camera under the hood. The front camera is expected to be a decent 8MP sensor for selfies and video calling.
However, we are yet to get final confirmation about the pricing and availability of this upcoming smartphone. We are expecting more information in the upcoming days.