LeEco LEX622 With Helio X20 SoC and 3GB of RAM Pays a Visit to Geekbench

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Not so long ago, LeEco, the Chinese smartphone vendor unveiled the LeEco Le Pro 3 and Le S3 in the US and Chinese markets. It looks like the company is working on another smartphone with MediaTek chipset under-the-hood.

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The LeEco LeX622, which might be the upcoming smartphone has been spotted on graphics benchmarking site, Geekbench. This is the first time the smartphone got leaked. Though the listing hasn't revealed the complete specifications of the smartphone, it has shed light on some key specs.

LeEco LEX622 With Helio X20 SoC, 3GB of RAM Pays a Visit to Geekbench

The LeEco LeX622, according to the Geekbench listing, will feature the MediaTek Helio X20 (MT6797) chipset, which is a deca-core processor with all the ten cores clocked at 1.39GHz. Coupled with the chipset will be 3GB of RAM and the smartphone will boot Android Marshmallow based EUI out-of-the-box.

As of now, we don't have any further details regarding the screen size and other specifications of the smartphone along with the launch date as well. However, going by the operating system on the phone, we are expecting the smartphone to debut in early 2017 or at the CES 2017.

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