MediaTek has finally pulled the curtains regarding the company's flagship chipset. Named as the Helio X30, the chip is manufactured on 10nm FinFET process.
Last year, the chipmaker announced the first deca-core processor and the Helio X30 also comes with 10 cores and tri-cluster design. The deca-core CPU is divided into Two-Cortex A35 cores clocked at 2GHz and Four-Cortex A53 cores clocked at 2.8GHz to handle less intensive tasks. Also, there are Four-Cortex A73 cores clocked at 2.8GHz to handle all the processor heavy tasks.
The GPU used by the chipset will be the new quad-core PowerVR 7XT GPU. The Helio X30 can handle 40MP camera sensors which record up to 24fps, 16MP camera sensors up to 60fps, and 8MP camera sensors up to 120fps. It is also said that the new processor can handle up to 8GB of RAM.
The company also confirmed that the chipset won't be released until next year. Also, at this point of time, there are no words on which smartphone will be powered by the Helio X30. The chipset will compete with the likes of Snapdragon 820/823 and Samsung's Exynos 8890 as both are built on 14nm manufacturing process.
As per the AnTuTu Benchmark leak in April, the chipset outperformed the Snapdragon 820 in terms of AnTuTu score. However, we need to wait on how it performs in real life.