Samsung to use a new type of high performance chipset in its future smartphones

Samsung has just announced that it has added 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio. What this means for the general consumers is that they will now have an even wider range of options for Samsung's next-generation products.

"Samsung has added the 11nm process to our roadmap to offer advanced options for various applications," said Ryan Lee, Vice President and Head of Foundry Marketing at Samsung Electronics. "Through this, Samsung has completed a comprehensive process roadmap spanning from 14nm to 11nm, 10nm, 8nm, and 7nm in the next three years."

In a press release, Samsung states that through further scaling from the earlier 14LPP process, 11LPP delivers up to 15 percent higher performance and up to 10 percent chip area reduction with the same power consumption. 14nm CPUs can be found on some Samsung's 2017 A and J series smartphones.

Interestingly, the company expects its 11nm process to bring differentiated value to mid- to high-end smartphones. The new process technology is scheduled to be ready for production in the first half of 2018.

Apart from the 11nm process, Samsung has also confirmed that it is also developing 7LPP with EUV (extreme ultraviolet) lithography technology. The company is targeting its initial production in the second half of 2018.

Details of the recent update to Samsung's foundry roadmap, including 11LPP availability and 7nm EUV development, will be elaborated at the Samsung Foundry Forum Japan on September 15, 2017, in Tokyo. At the meet, Samsung usually shares insights on its cutting-edge process technologies with global customers and partners.