Sony Xperia SP Details Leaked Ahead of MWC 2013 Debut

Leaks are so much fun, especially when they come from a reliable source. Details of Sony's high-end Android smartphone Xperia SP have been leaked and Xperia Blog claims it comes from a trusted source .

The device codenamed as HuaShan is said to come with a 4.6-inch touchscreen display with 720p resolution, Qualcomm Snapdragon S4 Pro MSM8960T 1.7GHz dual-core processor paired with Adreno 320 graphics, 8MP Exmor RS camera, 8GB of internal storage along with microSD memory card slot. The blog also mentions, that the smartphone might come with a transparent bar, which can be customized to certain notifications

The Phone is said have an aluminum frame build coupled with a plastic back. The smartphone will weigh in at155 grams and have dimensions equivalent to 1130.6 x 67.1 x 9.98mm.

The leaks have emerged conveniently in the 11th hour of the MWC 2013. Perhaps we will see the unavailing of the smartphone in the event, after all.

This is it, the countdown has already began to the Mobile World Congress 2013.This February 25, Barcelona will play host to the much awaited event which will stretch over a span of 4 days. Gizbot has reported about so many devices that are rumored to be featured in the up-coming event. So we ask you a question, what are you most exited about, in this event?