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Seems like Qualcomm will launch its next-gen Snapdragon 845 processor sooner than expected. Fresh information sourced from Weibo (via GizmoChina) suggests the company may unveil the chipset as early as in December this year.
The Weibo user has also leaked a poster said to be of an upcoming Qualcomm event. The event is named Snapdragon Technology Summit, and it will take place between December 4 to December 8. We may expect the unveiling of Snapdragon 845 processor during the event. However, Qualcomm is unlikely to start the mass production for this chipset before the end of 2018.
The Snapdragon 845 SoC is reportedly manufactured on 10nm Low Power Early (LPE) FinFET process. Going by the existing rumors, the chipset comprises of four ARM Cortex-A75 cores and four ARM Cortex-A55 cores. The processor is further coupled with the Adreno 630 GPU for added graphical performance.
The Adreno 630 is expected to deliver significantly improved graphics performance compared to its predecessor Adreno 540. It is also expected to be optimized for AR, VR as well as XR. Also, the Qualcomm Snapdragon 845 SoC is believed to feature updated Kryo cores.
Moreover, the upcoming chipset is likely to be equipped with the X20 modem which can provide downlink speed of up to 1.2Gbps.
Rumors have it, the Snapdragon 845 chipset will make its debut in Samsung Galaxy S9 and S9 Plus. The entire first production batch of the new chipset will reportedly be sold to Samsung for its upcoming flagship phones.
Quite interestingly, reliable tipster Roland Quandt claims Qualcomm has already started working on Snapdragon 855 that will probably power flagship phones releasing in 2019. Codenamed as Hana v1.0, the chipset is said to be built on the 7nm process.
Well, to be honest, we are just waiting for the Snapdragon 845 since the Snapdragon 455 seems far-fetched as of now.