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Last year fared pretty badly for leading mobile chip maker Qualcomm. But comes 2016, and the company has come up with a bang. The long awaited Qualcomm Snapdragon 820 brings a lot of promise and have succeeded to reserve its place under the hood of many flagships out there in the market.
The top beneficiaries of the chip include the Xiaomi Mi5, LeTv Le Max Pro, Samsung Galaxy S7, LG G5 etc. And guess what, the chip has already topped all benchmark out there and have also helped the Xiaomi Mi5 grab a top spot in the Antutu Benchmark.
Qualcomm however isn't ready to be over buoyed by their success, as the company is reported to be prepping on a new Snapdragon 823 chip. Summing up the leaked infos, it seems that the SD823 will come with the same architecture as the SD820, but the difference will lie in the higher clocked cores.
Well, a number of upcoming flagship devices are also reported to sport the Snapdragon 823 chip and here's a list of all them.
The upcoming flagship phablet from Xiaomi is expected to come with this new chip under the hood. For those unware the last year's Xiaomi Mi Note and Mi Note Pro came with a SD801 and SD810 chips respectively. Hence the Mi Note 2 is expected to be a huge upgrade, at least on paper. Other specs include a 5.7 inch QHD display with Force Touch capabilities and 4GB RAM.
The upcoming Galaxy Note smartphone is reported to come with this new chip underneath. Leaks regarding the smartphones broke out yesterday. Apart from the Snapdragon 823, the Samsung Galaxy Note 6 is expected to sport 6GB RAM, 5.8 inch display and IP67 waterproofing capabilities. Samsung is also expected to launch a Exynos 8890 powered variant of the Note 6.
The HTC 10 may be launched yesterday, but that doesn't stop the Taiwanese company to prepare for a Mini version of the same. Tipped to launch in September 2016, the HTC 10 Mini is reported to sport the exteriors of the bigger sibling with a relatively small 4.7 inch display and Snapdragon 823 chip under the hood.
LG G Flex 2 successor is awaited for long and the news regarding the G Flex 3 have finally broken. The flagship Flex lineup renowned for its flexible design is a feather to the cap of LG's designer team. Well, the LG G Flex 3 will be no different. Apart from sporting a new design language the LG G Flex 3 is expected to come with a SD823 chip under the hood.
The upcoming Sony Xperia flagship is expected to come with a Snapdragon 823 chip under the hood. As of now much details regarding the alleged smartphone isn't known, but expect more leaks in the coming few weeks.