MediaTek Dimensity 8400 SoC Launched with All Big CPU Cores: Ultra-Version Will Power Redmi Turbo 4

MediaTek has introduced the Dimensity 8400, succeeding the previous Dimensity 8300 SoC. This marks the debut of an All Big Core design in premium smartphones, according to MediaTek. The new chip features an eight-core Arm Cortex-A725 processor, reaching speeds up to 3.25GHz, offering a 41% boost in multi-core performance compared to its predecessor.

The MediaTek Dimensity 8400 SoC is equipped with a robust NPU designed for Gen-AI tasks. It incorporates MediaTek's Dimensity Agentic AI Engine (DAE), transforming traditional AI applications into advanced agentic AI solutions. This innovation allows developers to create applications that anticipate user needs and adapt accordingly.

Enhanced Graphics and Gaming Performance

The Arm Mali-G720 GPU in the Dimensity 8400 promises a 24% increase in peak performance and a 42% improvement in power efficiency over the Dimensity 8300. This GPU works alongside MediaTek Frame Rate Converter (MFRC) for smoother gameplay and MediaTek Adaptive Gaming Technology (MAGT) 3.0, which optimises game and app performance in real-time.

The MediaTek NPU 880 supports global mainstream LLM/SLM/LMMs and integrates DAE, first seen with the flagship Dimensity 9400 SoC. This integration enables developers to craft innovative agentic AI applications that predict user preferences and adjust accordingly.

Advanced Imaging Capabilities

The MediaTek Imagiq 1080 ISP utilises QPD remosaic technology to capture more light, focus faster, and produce high-resolution images. The chip also supports HDR recording across the entire zoom range, enhancing photo quality significantly.

For connectivity, the Dimensity 8400 includes a 5G-A modem supporting up to 3CC-CA and speeds up to 5.17Gbps. It features Network Observation System (NOS) technology for precise switching between 5G and Wi-Fi networks.

Specifications Overview

The specifications of the MediaTek Dimensity 8400 include one Arm Cortex-A725 core at 3.25GHz with a cache of 1MB L2, three Arm Cortex-A725 cores at 3.0GHz with a cache of 512MB L2, and four Arm Cortex-A725 cores at 2.1GHz with a cache of 256KB L2. It also boasts a total of 6MB L3 + 5MB SLC cache.

The GPU is an Arm Mali-G720 MC6 operating at up to 1.3GHz. The APU supports up to ten billion parameters with improved power efficiency by 18%, faster text generation by Baichuan at a rate of 33%, and enhanced speed in Stable Diffusion v1.5 by 21%. It also supports Diffusion Transformer technology.

Display and Connectivity Features

The chipset supports displays up to WQHD+ at a refresh rate of 120Hz or Full HD+ at up to 180Hz, along with HDR10+ Adaptive support. Camera capabilities extend up to a resolution of 320MP or three cameras each at up to 32MP using Imagiq's HDR-ISP technology.

Connectivity options include support for multiple network modes from Sub-6GHz (FR1) through various generations from GSM to advanced LTE configurations like VoNR/EPS fallback. It also offers GPS compatibility with systems such as NavIC L5.

Upcoming Devices Featuring Dimensity Technology

MediaTek announced that devices powered by the Dimensity 8400 SoC will be available by late 2024. Xiaomi confirmed that its Redmi Turbo 4 would be among the first phones featuring this customised platform early in the following year. Realme has revealed plans for its upcoming phone under the co-creation plan named "Dimensity Endurance Ares," expected to be part of their Realme Neo7 SE lineup.